Power chips are connected to exterior circuits via product packaging, and their efficiency depends on the assistance of the packaging. In high-power scenarios, power chips are usually packaged as power modules. Chip interconnection refers to the electrical link on the upper surface of the chip, which is usually aluminum bonding cable in traditional components. ^
Conventional power component package cross-section
Today, commercial silicon carbide power modules still mostly make use of the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They encounter problems such as huge high-frequency parasitical specifications, not enough warmth dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The screen of superb efficiency. In order to fix these issues and completely manipulate the huge potential benefits of silicon carbide chips, lots of brand-new product packaging innovations and services for silicon carbide power modules have emerged in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold wire bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold wires to copper cords, and the driving force is cost decrease; high-power tools have actually established from aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item performance. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a solid copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding product packaging methods, Cu Clip innovation has the complying with advantages:
1. The link between the chip and the pins is made of copper sheets, which, to a specific level, changes the basic wire bonding approach in between the chip and the pins. Consequently, a special plan resistance value, greater current flow, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can completely save the cost of silver plating and bad silver plating.
3. The product look is completely constant with normal items and is mostly utilized in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.
Cu Clip has two bonding methods.
All copper sheet bonding approach
Both eviction pad and the Resource pad are clip-based. This bonding approach is extra expensive and complicated, yet it can achieve much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad makes use of a Clip method, and eviction utilizes a Cable technique. This bonding approach is slightly cheaper than the all-copper bonding approach, conserving wafer area (applicable to really tiny gate locations). The process is simpler than the all-copper bonding technique and can obtain better Rdson and better thermal effect.
Provider of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper bottle, please feel free to contact us and send an inquiry.
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